3-D Chips: IBM Moves Moore’s Law Into The Third Dimension

-from Science Daily

Science Daily — IBM has announced a breakthrough chip-stacking technology in a manufacturing environment that paves the way for three-dimensional chips that will extend Moore’s Law beyond its expected limits. The technology – called “through-silicon vias” — allows different chip components to be packaged much closer together for faster, smaller, and lower-power systems.
IBM [...]

IBM doubles CPU cooling capabilities with simple manufacturing change

-from ars technica
By Joel Hruska | Published: March 25, 2007 - 10:03PM CT
According to a new paper released at the IEEE Semi-Therm conference, IBM has discovered a way to dramatically improve processor cooling. Unlike some other recent cooling breakthroughs, IBM’s discovery appears to be one that should be relatively inexpensive to implement, and [...]